nVent Launches nVent SCHROFF High Thermal Integrated Conduction Cooled Assembly
May 11, 2021
nVent Electric plc, a global provider in electrical connection and protection solutions, recently launched a new High Thermal Integrated Conduction Cooled Assembly for the aerospace and defense industries. Designed for rugged conduction cooled assemblies (CCAs) in VPX systems, the High Thermal Integrated CCA design innovatively removes a thermal interface resulting in up to 40 percent improved module thermal resistance, depending on the configuration. The design integrates nVent SCHROFF’s Calmark High Thermal Sawtooth Card-Lok design into the module frame, cost effectively optimizing size, weight and power (SWaP) requirements in military and aerospace systems.
“For customers facing thermal challenges in their VPX systems, leveraging the new High Thermal Integrated CCA technology can help them avoid a major module redesign,” says Amy Escobio, nVent global marketing director. “This is because the integrated CCA design is available as a drop-in replacement for traditional VITA conduction cooled modules.”
The High Thermal Integrated CCA meets the latest VITA standards, is designed for high performance/mission critical applications and offers 2nd level maintenance options. nVent offers downloadable CAD files and 3D printed prototyping for customers for fit checks. nVent supports numerous other customization options as well. Customers can partner with the experienced nVent SCHROFF brand engineering team to solve thermal challenges before the first prototype is machined. Customers can simply provide their board layout and the engineers can design a thermally-efficient CCA design to meet the application.
