Molex Releases Report on Thermal Management Challenges and Opportunities for I/O Modules amid Emerging Solutions for Next-Gen Data Center Cooling
Molex has published a report that examines thermal management pitfalls and possibilities as data center architects and operators strive to balance high-speed data throughput requirements with the impacts of growing power density and the need for heat dissipation on critical servers and interconnect systems. Molex’s In-Depth Report of Thermal Management Solutions for I/O Modules addresses the limitations of legacy approaches for thermal characterization and management and explores new innovations in server and optical module cooling to better support 112G and 224G connectivity.
