Zuken Joins TSMC’s Open Innovation Platform EDA Alliance
Zuken Inc. recently announced that it has joined the EDA Alliance in TSMC’s Open Innovation Platform (OIP). TSMC collaborates with its OIP EDA Alliance partners to address growing design demands, accelerate adoption of latest process and packaging technologies, and enable customers to achieve their PPA and time-to market targets. By participating in this alliance, Zuken will further enhance its IC packaging and printed circuit board (PCB) design products with the capabilities essential to support multi-die and chiplet-based designs using TSMC’s technologies.
